Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning Machines Video, Demo, How It Works & Features
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Product Specifications
Model NO.:
FD-300QA
After-sales Service:
12months
Warranty:
12months
Type:
Surface Grinding Machine
Processing Object:
Flat Workpieces
Abrasives:
Grinding Wheel
Controlling Mode:
Pcl
Automatic Grade:
Semiautomatic
Cylindrical Grinder Type:
Surface Grinding Machine
Precision:
High Precision
Certification:
ISO 9001
Condition:
New
Power Source:
Electricity
Disc(Wheel) Type:
Grinding Disc
Variable Speed:
with Variable Speed
Application:
Semiconductor Material
Material:
Metal and Non-Metal
Working Style:
Reduction
Disc Diameter:
Φ300
Service:
Oversea Setup & After-Sale Avalaible
Class:
Single Plate
Process Station:
3
Pressure Source:
Pneumatic or Weight Block
Plate Material:
Metal & Non-Metal
Abrasive:
Slurry
Weight:
1000kg
Trademark:
PONDA
Transport Package:
Wood Crate
Origin:
China