T3 T4 Sac305 Sn63pb37 Leaded Low Temp No Clean PCB Reflow Soldering BGA Ppd SMD SMT Lead Free Bismuth Silver Copper Tin Solder Paste for Electronics 63 37 42 58 Video, Demo, How It Works & Features
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Product Specifications
Model NO.:
Solder Paste
state:
Liquid
pH:
Neutral
Type:
Resin
Melting Point:
200℃-300℃
Chemical Composition:
Tin Lead Silver Copper
Function:
Remove Oxides, Protect Weld Metal, Make the Liquid Solder Flow
Application:
SMT Soldering
Manufacturing Method:
Smelting
Alloy:
Lead Free
Alloy 2:
Sac305 Sn96.5AG3.0cu0.5
Alloy 3:
Sac0307 Sn99AG0.3cu0.7
Alloy 4:
Sn42bi58 Low Temperature
Powder Size:
Type 3: 25 to 45 Microns
Powder Size 2:
Type 4: 20 to 38 Microns
Flux:
No Clean Flux
Certificate:
RoHS
Packing:
Jar
Packing 2:
Syringe
Shipping:
Courier / Air Freight
Shelf Life:
6months
Storage:
0 to 10 Degree Celsius
Application 1:
SMD Soldering
Application 2:
SMT Soldering
Trademark:
XF Solder
Transport Package:
Foam Box
Specification:
100g to 1000g
Origin:
China
HS Code:
3810100000