Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing Video, Demo, How It Works & Features
This video cannot be played in your browser.
Need price or Contact this supplier?
Get a Quote
Product Specifications
Model NO.:
MG-6410B-AU
Certification:
GS, RoHS, CE, ISO9001
Color:
Transparent
Heat Resistance:
Normal Temperature
Waterproof:
Waterproof
Application:
Wafer Dicing
Adhesive:
Acrylic
Base Material:
Po Film
Type:
Wafer UV Dicing Tape
Product Name:
UV Release Dicing Tape
Liner:
Pet Release Liner
Feature:
Easy Peeling No Residue
Adhesion Before UV:
280~380 G/in
Adhesion After UV Irradiation:
< 10 G/in
Customization:
Available
Trademark:
Migui
Transport Package:
Carton
Specification:
customizable
Origin:
Dongguan