1.15mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging

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Min Order 20 g
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Shenzhen Silver Technologies Ltd

VIP   Audited Supplier 4 years
Profile Certified by SGS/BV
1.15mil
Bare
Alloy
Microelectronics, LED Packaging, IC Packaging
Alloy
Round Wire
Microelectronics, LED Packaging, IC Packaging
ISO9001, CE, CCC, RoHS
500m or 1000m
0.7-3.0mil
Au, AG, Pd, Cu
Bubble Chamber, Paper Box
China
Product Description
 
Product Description

 Copper Bonding WireGold Alloy Bonding Wire
Silver Alloy Bonding Wire
Bonding Wire are mostly used for IC & LED packaging. The types we have are: Aluminum Silicon bonding wire, Silver Alloy Bonding Wire, Pd coated Copper wire.
TX Copper (Cu) bondingwireoffers significant cost advantage over Gold (Au) bonding wire. Our Cu bonding wire is an excellent replacement for Au bonding wire due to its similar electrical properties and the cost advantages.
Self inductance and self capacitance are nearly the same and Cu bonding wire has lower resistivity. 
In applications of QFP, QFN and SOIC where resistance due to bond wire can negatively impact circuit performance, using TX Cu bonding wire can offer better improvement. Also, a tailor-made concept of TX Tech is partnering with various interested parties for advanced packaging to continue to expand knowledge and lead technology development.
More infomation can view here.

Product Parameters

 

 
Shenzhen Silver Technologies Ltd mainly acts as an agent, develops, produces and sells packaging tools and materials such as single crystal copper, copper alloy, key alloy wire, gold palladium copper wire, alloy wire, super-soft copper wire, packaged gold tape, pure aluminum wire, cleaver, steel nozzle, film, etc. At the same time, it can also tailor products with special parameters and requirements for enterprises.

Products of each project team:

1. High purity metal (pure platinum wire, pure gold particles, high purity silver wire, high purity single crystal copper)

2. Precious metal alloys (platinum iridium, platinum rhodium, gold and silver, gold and silver palladium, copper palladium, silver palladium, gold and tin alloys)

3. Copper alloy (silver copper alloy, tin copper alloy)

4. Stranded enameled wire (polyimide, polyurethane )

5. Semiconductor materials (key alloy belt, key alloy wire, gold palladium copper wire, pure aluminum wire, steel nozzle, cleaver)

6. Imported chips (Infineon, Ansemy, ST, TI)
 
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