Double SideD PCB-3
                        Rigid Circuit Board
                        FR-4
                        Fiberglass Epoxy
                        V0
                        Rigid
                        Electrolytic Foil
                        Fr-4
                        Organic Resin
                        FR-4
                        Kb
                        OSP,Immersion Gold,Hal Lead Free,Hal
                        Green,Red,Yellow,White,Black,Blue,etc
                        Air,Sea,Express(DHL TNT FedEx EMS UPS)
                        5-7 Days
                        ZAPON
                        Vacuum Packing
                        UL, TS16949, IPC 600 CLASS 2
                        China
                        85240090
                        
                        Product Description
                    
                                
                        ZHEJIANG ZAPON ELECTRONIC TECHNOLOGY Co., Ltd is a professional manufacture of PCB and PCBA. Which have the factory of single side PCB, double side PCB, multi-layer PCB and PCB assembly etc. We have the ability of produce for any medium and mass quantity. The machine of our factory are on work all day and all night. With Zapon as a supplier, you will have the highest quality, quickest delivery.
The products:
Single-side PCB: CEM-1, FR-2, FR-1 XPC-94HB
Double-side PCB: FR-4, CEM-3, High Tg, Aluminum, Halogen Free
Multi-layer PCB: 4 to 22 layers(FR-4, High Tg, Rogers)
Certification: UL, ISO9001, ISO/TS16949: 2002, IS014001 and RoHS
THE CAPACITY OF PRODUCTION: 50, 000SQM. /month
                    
                The products:
Single-side PCB: CEM-1, FR-2, FR-1 XPC-94HB
Double-side PCB: FR-4, CEM-3, High Tg, Aluminum, Halogen Free
Multi-layer PCB: 4 to 22 layers(FR-4, High Tg, Rogers)
Certification: UL, ISO9001, ISO/TS16949: 2002, IS014001 and RoHS
THE CAPACITY OF PRODUCTION: 50, 000SQM. /month
| Item | Capabilities | |
| Number of Layers | Double Side | |
| Material | FR-4, CEM-3, HighTg, Aluminum, Halogen Free  | |
| PCB Thickness | Min. thickness | 0.2mm(8mil) | 
| Max. thickness | 3.2mm(128mil) | |
Surface finished  | Gold Plating | |
| Immersion Gold(Silver) | ||
| HAL Lead Free | ||
| Hot Air Solder Leveling(HASL) | ||
| Entek Coating (OSP) | ||
| Solder Mask | Green, White, Black, Yellow, Red, Blue | |
| Other printing | Gold Finger | |
| Carbon Print, Peelable Mask | ||
| Solder Mask Plugged Hole | ||
| Copper thickness | 1/ 2 oz (18 μ m) - 4 oz (140 μ m) | |
| Min. Finished Hole Size | 0.3mm(12mil) | |
| Hole Size Tolerance (PTH) | +/ -0.076mm (3 mil) | |
| Hole Size Tolerance (NPTH) | +/-0.05mm (2 mil) | |
| Min. Line Width and Spacing | 0.10mm (4 mil) | |
| Min. Solder Mask Clearance | 0.076mm (3 mil) | |
| Min. Annular Ring | 0.1mm (4mil) | |
| Profile and V-Cut | CNC-Routing, Stamping and Beveling, V-CUT, CNC | |
| Special Process | Micro-section, Chamfer for Gold Finger | |



  
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