Audited Supplier
Gold-Tin Solder Seal Lids
OEM, ODM
1-2 Weeks
RoHS, ISO 9001, ISO 14001, GB/T 29490
Air Freight
XianYi
Waffle Box, Bulk Packaging
Au80Sn20 Solder Seal Lids
Guangzhou
8542900000
Product Description
Gold-Tin Solder Seal Lids
Features:
- Simplified packaging process
- Six-sided electroplating, high corrosion resistance
- Eutectic alloy, good wettability
- Precise tacking
- High gas tightness and high reliability
Description:
Au-Sn alloy solder is one of the most commonly used solders in hermetic packaging, and gold-tin solder preforms are widely used in hermetic packaging of metal or ceramic shells. In the traditional packaging process, it is difficult to locate the solder tabs, which often affects the gas tightness due to uneven solder.
The AuSn solder seal lid consists of a lid with a gold-tin solder preform tack-welded on it. With the self-developed six side electroplating process and micro spot welding technology, the corrosion resistance and firmness of the product are guaranteed, the positioning problem existing in the traditional process is solved, and the packaging process is simplified. The product has been widely used in hermetic packaging of microwave RF modules, FPGA, MEMS devices and optoelectronics.
Solder Composition:
Specification
Method of Use
Referential soldering process
Operating environment
Thickness of Au layer on pads
Au layer with a thickness of 0.8~1.5μm is favorable.
Reflow parameters
Operation Details:
- Picking up:
Use an anti-static tools to pick up the solder to prevent solder contamination and deformation.
Storage and Product Management:
- Storage
The best storage temperature of this product is 25±5 ºC, and the relative humidity is no higher than 55%RH.
- Product management
Keep container tightly closed when product is not in use.
Safety:
- Please use this product with adequate ventilation and certain personal protection conditions.
- Please do not mix with other toxic chemicals.
Features:
- Simplified packaging process
- Six-sided electroplating, high corrosion resistance
- Eutectic alloy, good wettability
- Precise tacking
- High gas tightness and high reliability
Description:
Au-Sn alloy solder is one of the most commonly used solders in hermetic packaging, and gold-tin solder preforms are widely used in hermetic packaging of metal or ceramic shells. In the traditional packaging process, it is difficult to locate the solder tabs, which often affects the gas tightness due to uneven solder.
The AuSn solder seal lid consists of a lid with a gold-tin solder preform tack-welded on it. With the self-developed six side electroplating process and micro spot welding technology, the corrosion resistance and firmness of the product are guaranteed, the positioning problem existing in the traditional process is solved, and the packaging process is simplified. The product has been widely used in hermetic packaging of microwave RF modules, FPGA, MEMS devices and optoelectronics.
Solder Composition:
| Element | Wt% |
| Gold (Au) | Margin |
| Tin (Sn) | 20.0 ± 0.5 |
Specification
| Lid Material | 4J29, 4J42, MoCu, ceramics, etc. |
Lid Finishes | Ni:1.27-8.9 μm Au:0.65-5.7 μm * Plating structure can be customized according to customer requirements. |
Method of Use
Referential soldering process
Operating environment
| Atmosphere | Parameter requirements |
| N2 | Oxygen concentration(200~ 1000ppm) |
| Vacuum | Vacuum degree ≤ 2.0×10-3Pa |
Thickness of Au layer on pads
Au layer with a thickness of 0.8~1.5μm is favorable.
Reflow parameters
Reflow profile of Au80Sn20 Solder Preforms
(For reference only, the reflow profile should be adjusted according to the actual soldering situation)
(For reference only, the reflow profile should be adjusted according to the actual soldering situation)
Operation Details:
- Picking up:
Use an anti-static tools to pick up the solder to prevent solder contamination and deformation.
Storage and Product Management:
- Storage
The best storage temperature of this product is 25±5 ºC, and the relative humidity is no higher than 55%RH.
- Product management
Keep container tightly closed when product is not in use.
Safety:
- Please use this product with adequate ventilation and certain personal protection conditions.
- Please do not mix with other toxic chemicals.
