Audited Supplier
| Name | Lead-free solder paste |
| Alloy | Sn96.5Ag3Cu0.5 |
| Package | 500g/bottle |
| Melting point | 217~220ºC |
| Particles | 25-38um(custom made) |
| Viscosity | 180±30Pa.S |
| Copper corrosion | Not happen |
| Type | Ingredient (WT%) | Melting point (ºC) | Application scenario |
| Lead paste | Sn63Pb37 | 183 | Suitable for demanding circuit boards, such as: high-precision instruments, electronic industry, communications, micro-technology, aviation industry and other products welding |
| Sn62.6Pb37Ag0.4 | 183-190 | ||
| Sn60Pb40 | 183-203 | ||
| Sn55Pb45 | 183-215 | Applicable to the requirements of ordinary circuit boards, such as: home appliances, electrical instrumentation, automotive electronics, hardware and electrical appliances and other products welding | |
| Sn50Pb50 | 183-227 | ||
| Sn45Pb55 | 183-238 | ||
| Lead-free solder paste | Sn99Ag0.3Cu0.7 | 183-248 | Low cost, high melting point. Can be used for less demanding welding |
| Sn96.5Ag3.0Cu0.5 | 183-258 | High cost, good performance, suitable for high-demand welding | |
| Sn64.7Ag0.3Bi35 | 183-266 | Good performance, low melting point, and finer lattice alloys | |
| Sn64Ag1.0Bi35 | 183-279 | High cost, good performance, commonly used lead-free solder | |
| Sn42Bi58 | 227 | Prevent corrosion by CU, suitable for low temperature welding |
Our product comes in environmentally friendly green cans, with a default weight of 500 grams, customizable to meet specific customer needs. Each can is labeled with essential details including the product model, alloy composition, batch number, and weight. Additionally, the solder paste label provides concise instructions for use, along with safety and health guidelines. "ZS.HX Zhongshi" is the proud registered trademark of our company.
For enhanced storage stability, store the solder paste in a cool environment at 5 ºC. When kept at room temperature of 25 ºC or in a controlled setting of 35 ºC, monitor the viscosity periodically over 180 days at 25 ºC and 90 days at 35 ºC, ensuring the increase in viscosity remains below 10%.
Regarding continuous printing stability, maintain the same solder paste for 8 hours of printing and assess the viscosity using a steel net. Continue this process after storage and repeat for 3 consecutive days. Consistent viscosity is confirmed after three days of ongoing printing.
Lead-free solder wire
Tin-lead solder wireSolder bar
Our products are compliant with ROHS and REACH standards, having undergone rigorous testing and certification. With every order, we provide a corresponding SGS certificate along with a material safety data sheet. For further details on this product's MSDS, our sales team is available to assist you.
