Manual Ultrasonic Wedge Wire Bonding Machine

High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment,auto sensors, wire bonding, TO-3,TO-3P,TO-3PF,TO-3PN,TO-3PL,TO-220F,TO-126, TO-12F,TO-66,TO-251,TO-202 etc.

Specification:

1,electric requiement:220VAC±10%,50HZ,be sure connected to ground 2,aluminium wire diameter:75~500μm (3~20mil)
3,ultrasonic power:0-30W, two channel.can be set separately of the two point 4,bond time:10-500ms,two channel
5,bond force:30-1200g,two channel
6,motorized Y:0-18mm
7,microscope rate:7.5 and 15
8,working area:Φ25mm
9,light:adjustable brightness
10,size:620×610×560mm
11,weight:~40kg 
------------------------------------------------------------------------------------------------------------------------------------------------------------