Power Mosfet To252 Osg80r650df Vds-850V ID-24A RDS (ON) -650milliohm Qg-12.1nc

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Shanghai Winture Electric Co., Ltd.

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  • Shanghai, China
  • Joy Li (Ms.)  
TO252 OSG80R650DF
RoHS, ISO
Metal Porcelain Tube
Sharp Cutoff Shielding Tube
Air Cooled Tube
Switch Transistor
High Frequency
Planar
Chip Transistor
High Power
Silicon
Orientalsemi
China
8541290000
Product Description


General Description
The GreenMOS®  high voltage MOSFET utilizes charge balance technology to achieve outstanding low on-resistance and lower gate charge.  It is engineered to minimize conduction loss, provide superior switching performance and robust avalanche capability.
The  GreenMOS®   Generic  series  is  optimized  for  extreme  switching  performance  to  minimize switching  loss.  It  is tailored for  high  power density applications  to  meet the  highest  efficiency standards.

Features
     Low RDS(ON) & FOM
     Extremely low switching loss
     Excellent stability and uniformity

Applications
     PC power
     LED lighting
     Telecom power
     Server power
     EV Charger
     Solar/UPS

Key Performance Parameters

ParameterValueUnit
VDS, min @ Tj(max)850V
ID, pulse24A
RDS(ON) , max @ VGS =10V650mΩ
Qg12. 1nC


Absolute Maximum Ratings at Tj =25°C unless otherwise noted

ParameterSymbolValueUnit
Drain-source voltageVDS800V
Gate-source voltageVGS±30V
Continuous drain current1) , TC=25 °C
ID
8
A
Continuous drain current1) , TC=100 °C5
Pulsed drain current2) , TC=25 °CID, pulse24A
Continuous diode forward current1) , TC=25 °CIS8A
Diode pulsed current2) , TC=25 °CIS, pulse24A
Power dissipation3) , TC=25 °CPD83W
Single pulsed avalanche energy5)EAS240mJ
MOSFET dv/dt ruggedness, VDS =0…480 Vdv/dt50V/ns
Reverse diode dv/dt, VDS =0…480 V, ISDIDdv/dt15V/ns
Operation and storage temperatureTstg , Tj-55 to 150°C


Thermal Characteristics

ParameterSymbolValueUnit
Thermal resistance, junction-caseRθJC1.5°C/W
Thermal resistance, junction-ambient4)RθJA62°C/W


Electrical Characteristics at Tj =25°C unless otherwise specified

ParameterSymbolMin.Typ.Max.UnitTest condition
Drain-source         breakdown voltage
BVDSS
800  
V
VGS =0 V, ID =250 μA
850930 VGS =0 V, ID =250 μA, Tj =150 °C
Gate threshold
voltage
VGS(th)2.0 4.0VVDS =VGS , ID =250 μA
Drain-source on- state resistance
RDS(ON)
 0.550.65
Ω
VGS =10 V, ID=4 A
 1.48 VGS =10 V, ID=4 A,
Tj =150 °C
Gate-source
leakage current

IGSS
  100
nA
VGS =30 V
  - 100VGS =-30 V
Drain-source
leakage current
IDSS  10μAVDS =800 V, VGS =0 V


Note
1)   Calculated continuous current based on maximum allowable junction temperature.
2)   Repetitive rating; pulse width limited by max. junction temperature.
3)   Pd is based on max. junction temperature, using junction-case thermal resistance.
4)    The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with Ta=25 °C.
5)    VDD=100 V, VGS =10 V, L=20 mH, starting Tj =25 °C.


Ordering Information

Package
Type
Units/
Reel
Reels/   Inner BoxUnits/   Inner BoxInner Boxes/ Carton BoxUnits/     Carton Box
TO252-C250025000525000


Product Information

ProductPackagePb FreeRoHSHalogen Free
OSG80R650DFTO252yesyesyes


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