General Description
The GreenMOS® high voltage MOSFET utilizes charge balance technology to achieve outstanding low on-resistance and lower gate charge. It is engineered to minimize conduction loss, provide superior switching performance and robust avalanche capability.
The GreenMOS® Generic series is optimized for extreme switching performance to minimize switching loss. It is tailored for high power density applications to meet the highest efficiency standards.
Features
- Low RDS(on) & FOM
- Extremely low switching loss
- Excellent stability and uniformity
Applications
- PC power
- LED lighting
- Telecom power
- Server power
- EV Charger
- Solar/UPS
- Key Performance Parameters
-
Parameter Value Unit VDS, min @ Tj(max) 700 V ID, pulse 240 A RDS(ON) , max @ VGS=10V 35 mΩ Qg 153.6 nC
Marking Information
Product Name Package Marking OSG65R035HTF TO247 OSG65R035HT
| Parameter | Symbol | Value | Unit |
| Drain-source voltage | VDS | 650 | V |
| Gate-source voltage | VGS | ±30 | V |
| Continuous drain current1), TC=25 °C | ID | 80 | A |
| Continuous drain current1), TC=100 °C | 50 | ||
| Pulsed drain current2), TC=25 °C | ID, pulse | 240 | A |
| Continuous diode forward current1), TC=25 °C | IS | 80 | A |
| Diode pulsed current2), TC=25 °C | IS, pulse | 240 | A |
| Power dissipation3) TC=25 °C | PD | 455 | W |
| Single pulsed avalanche energy5) | EAS | 1700 | mJ |
| MOSFET dv/dt ruggedness, VDS=0…480 V | dv/dt | 50 | V/ns |
| Reverse diode dv/dt, VDS=0…480 V, ISD≤ID | dv/dt | 15 | V/ns |
| Operation and storage temperature | Tstg, Tj | -55 to 150 | °C |
Thermal Characteristics
| Parameter | Symbol | Value | Unit |
| Thermal resistance, junction-case | RθJC | 0.27 | °C/W |
| Thermal resistance, junction-ambient4) | RθJA | 62 | °C/W |
Electrical Characteristics at Tj=25°C unless otherwise specified
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
Drain-source breakdown voltage | BVDSS | 650 | V | VGS=0 V, ID=2 mA | ||
| 700 | VGS=0 V, ID=2 mA, Tj=150 °C | |||||
| Gate threshold voltage | VGS(th) | 2.8 | 4.0 | V | VDS=VGS, ID=2 mA | |
Drain-source on- state resistance | RDS(ON) | 0.028 | 0.035 | Ω | VGS=10 V, ID=40 A | |
| 0.075 | VGS=10 V, ID=40 A, Tj=150 °C | |||||
| Gate-source leakage current | IGSS | 100 | nA | VGS=30 V | ||
| -100 | VGS=-30 V | |||||
| Drain-source leakage current | IDSS | 5 | μA | VDS=650 V, VGS=0 V | ||
| Gate resistance | RG | 2.4 | Ω | ƒ= 1 MHz, Open drain |
Dynamic Characteristics
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
| Input capacitance | Ciss | 7549.2 | pF | VGS=0 V, VDS=50 V, ƒ=100 kHz | ||
| Output capacitance | Coss | 447.1 | pF | |||
| Reverse transfer capacitance | Crss | 13.2 | pF | |||
| Turn-on delay time | td(on) | 52.3 | ns | VGS=10 V, VDS=400 V, RG=5 Ω, ID=40 A | ||
| Rise time | tr | 86.8 | ns | |||
| Turn-off delay time | td(off) | 165.2 | ns | |||
| Fall time | tf | 8.5 | ns |
Gate Charge Characteristics
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
| Total gate charge | Qg | 153.6 | nC | VGS=10 V, VDS=400 V, ID=40 A | ||
| Gate-source charge | Qgs | 41.8 | nC | |||
| Gate-drain charge | Qgd | 50.2 | nC | |||
| Gate plateau voltage | Vplateau | 5.8 | V |
Body Diode Characteristics
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
| Diode forward voltage | VSD | 1.3 | V | IS=80 A, VGS=0 V | ||
| Reverse recovery time | trr | 566.1 | ns | VR=400V, IS=40 A, di/dt=100 A/μs | ||
| Reverse recovery charge | Qrr | 13.2 | μC | |||
| Peak reverse recovery current | Irrm | 45.9 | A |
Note
- Calculated continuous current based on maximum allowable junction temperature.
- Repetitive rating; pulse width limited by max. junction temperature.
- Pd is based on max. junction temperature, using junction-case thermal resistance.
- The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with Ta=25 °C.
- VDD=100 V, VGS=10 V, L=60 mH, starting Tj=25 °C.













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