Audited Supplier
SnCu, SnAg, SnAgCu, SnAgCuSb, SnAgBi series.
Wire
Tin
Not Containing Flux
Non
Customerization
Damno
Plastic Spool, Drum, Plywood Pallet
0.5mm-3.2mm
Shaoxing, China
80030000
Product Description
Solder is an indispensable material for the manufacture of electronic products. Tin wire, tin bar, and tin paste are the most widely used electronic welding materials, the technical level depends on the performance of solder joints and welding process performance.
Tin base Babbitts are considered superior to Lead base alloys for most applications because they are easier to pour and provide a good bond between the bearing shell and lining. In this process, Babbitt ingots are melted and then poured into bearing cavities, allowed to harden, and then the surface is machined down to meet required tolerances.
Product code: solder wire
Chemical composition:
Diameter: 0.5mm≤Ф≤2.5mm
Product packing:
Pallet will be used, such as 1100mmX1100mm, 1200mmX800mm, 1000mmX1000mm, 800mmX800mm. There is a variety of Lead-free solder wire that has a smooth surface, neat coiling, beautiful appearance, uniform distribution of additives, and good continuity. Less splash of additives in the welding process, good mobility, good we1ability, less smoke, less oxide slag, and bright welding spots. For use as coating feedstock material for the electric arc wire spray processes.
Widely used in a variety of wave soldering and manual welding of television, audio, capacitors, circuit boards, and communications equipment. and look forward to your cooperation!
Tin base Babbitts are considered superior to Lead base alloys for most applications because they are easier to pour and provide a good bond between the bearing shell and lining. In this process, Babbitt ingots are melted and then poured into bearing cavities, allowed to harden, and then the surface is machined down to meet required tolerances.
Product code: solder wire
Chemical composition:
| ITEM | Melting Range (ºC) | Elements (%) | |||||||||||
| Sn | Ag | Cu | Sb | Pb | Cd | Fe | As | Al | Zn | Bi | TTL Impurities | ||
| S-SnCu0.7 | 227 | REMAINING | 0.1 | 0.5-0.9 | 0.1 | 0.05 | 0.0012 | 0.02 | 0.03 | 0.001 | 0.001 | 0.015 | 0.2 |
| S-SnCu0.3 | 227~235 | REMAINING | 0.1 | 0.2-0.4 | |||||||||
| S-SnCu3 | 227~310 | REMAINING | 0.1 | 2.5-3.5 | |||||||||
| S-SnAg1Cu0.5 | 217~227 | REMAINING | 0.8-1.2 | 0.3-0.7 | |||||||||
| S-SnAg3Cu0.5 | 217~220 | REMAINING | 2.8-3.2 | 0.3-0.7 | |||||||||
| S-SnAg4Cu0.5 | 217~219 | REMAINING | 3.8-4.2 | 0.3-0.7 | |||||||||
| S-SnCu0.7Ag0.3 | 217~227 | REMAINING | 0.2-0.4 | 0.5-0.9 | |||||||||
| S-SnCu4Ag1 | 217~353 | REMAINING | 0.8-1.2 | 3.5-4.5 | |||||||||
| S-SnCu6Ag2 | 217~380 | REMAINING | 1.8-2.2 | 5.5-6.5 | |||||||||
| S-SnSb5 | 235~240 | REMAINING | 0.1 | 0.05 | |||||||||
Diameter: 0.5mm≤Ф≤2.5mm
| DIAMETER (MM) | PERMISSIBLE VARIATION |
| 0.5-0.8 | ±0.03 |
| 0.8-1.2 | ±0.07 |
| 1.2-2.5 | ±0.1 |
Product packing:
| Hard paper drum | 100-150 kg | outer diameter 550 mm, inner diameter300mm, variable height |
| Hard paper drum | 20-50 kg | outer diameter 400 mm, inner diameter190mm. variable height |
| Plastic spool | 15 kg | flange300mm, width100mm, center hole:55mm |
| Plastic spool | 0.5-10 kg | |
| bundle | 10-20 kg |
Widely used in a variety of wave soldering and manual welding of television, audio, capacitors, circuit boards, and communications equipment. and look forward to your cooperation!
