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VIP   Audited Supplier2 Years

Jiangsu Himalaya Semiconductor Co., Ltd.  

Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
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Hot Products
High Speed Precision Automatic Semiconductor Equipment to IC Package Wafer Die Bond Die Bonding Attach $1000000.00MOQ:1 Piece
20W Fiber Laser Marking Machine Price for Metal, Steel, Iron, Aluminum, PVC, Keyboard, Bearings Engraving $7000.00MOQ:1 Piece
High Speed Fully Automatic Testing and Sorting Machine for Semiconductor Device $1000000.00MOQ:1 Set
High Precision FPC Package Dispenser Machine Automatic Silicone Wafer Equipment Factory MOQ:1 Piece
High Precision Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, Glass, Sic, PCB Board $500000.00MOQ:1 Set
Higher Accuracy Wire Bonding/Welding Machine for to, Sot, Sop, Ssop, Tssop, Solc, Qfp, DIP, BGA, COB $170000.00MOQ:1 Box
High Precision Vacuum Plasma Cleaning Machine Omnidirectional Surface Cleaning for Semiconductor $1000000.00MOQ:1 Piece
Xy Axis Carbon Dioxide Marking Machine $100000.00MOQ:1 Piece
High Precision Wafer Thinning Machine Grinding Equipment Manufacturers Industrial Automation Device MOQ:1 Piece
Automatic CCD Visual Glue Dispenser Machine Semiautomatic Three-Axis Desktop Dispensing Robot Equipment Factory MOQ:1 Piece
High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device $1000000.00MOQ:1 Set
High-Precision 3D Systems Mjp Jewelry Wax Model 3D Printer $100000.00MOQ:1 Piece
Company Profile
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in exporting business and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers! We manufacture equipments for Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting(Glass Ceramics Wafers Packaging, Laser Internal Modification Machine Si /Sic Wafe, Laser Internal Modification Machine Lt/Ln Wafer, Laser Annealing Machine for Si/Sic, Automatic Dicing Saw Machine(Wafer Packaging)), Automatic Silicone Dispensing Equipment. As well as we provide some solutions for handling exhausted metal sorter equipments, customized coating and plating machine, TGV & manual/semiautomatic/automatic equipments... [View More..]
Contact Us
Company Name Jiangsu Himalaya Semiconductor Co., Ltd.
Company Address Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China  
Location Jiangsu, China
Contact Person Mr. Jack
Department (Position) General Manager Office Departm (Deputy General Manager)

FAQ (Frequently Asked Questions)

1. Where is your company located?

Jiangsu Himalaya Semiconductor Co., Ltd. is located in Jiangsu in China. We welcome inquiries and visits by appointment. For further details or scheduling, please through the contact us page submit the form to contact us.

2. What products do you mainly export?

Our main products are Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment. Product availability and specifications may vary. For the most accurate and up-to-date information, please through the contact us page submit the form to contact us.

3. Can you handle shipping and customs?

We can assist with shipping arrangements including FOB, CIF, and other terms depending on your needs. Customs clearance varies by country and shipment. For specific shipping options and customs support, please through the contact us page submit the form to contact us.

4. What payment terms do you accept?

Common payment terms include T/T (telegraphic transfer), L/C (letter of credit), and Western Union. Specific terms depend on the order size and client agreement. For tailored payment options, please through the contact us page submit the form to contact us.

5. Can I get samples before placing a bulk order?

Yes, we usually provide samples for quality evaluation. Sample fees and shipping costs may apply, which can be deducted after order confirmation. Please through the contact us page submit the form to contact us to request samples and related terms.

6. How do you control quality?

We have strict quality control procedures during production, including inspections and testing. For specific quality assurance details or certifications, please through the contact us page submit the form to contact us.

7. What is the usual lead time for orders?

Lead time generally depends on the product type and order quantity, typically ranging from 3 to 30 days. For accurate lead times, please through the contact us page submit the form to contact us.

8. Do you provide OEM or custom packaging?

Yes, we support OEM and custom packaging services according to customer requirements. For more details and MOQ, please through the contact us page submit the form to contact us.

9. Can I visit your company or have a video factory tour?

Yes, visitors are welcome by appointment. We can also provide video tours for remote clients. For scheduling, please through the contact us page submit the form to contact us.