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VIP   Audited Supplier2 Years

Jiangsu Himalaya Semiconductor Co., Ltd.  

Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
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High Speed Precision Automatic Semiconductor Equipment to IC Package Wafer Die Bond Die Bonding Attach $1000000.00MOQ:1 Piece
20W Fiber Laser Marking Machine Price for Metal, Steel, Iron, Aluminum, PVC, Keyboard, Bearings Engraving $7000.00MOQ:1 Piece
High Speed Fully Automatic Testing and Sorting Machine for Semiconductor Device $1000000.00MOQ:1 Set
High Precision FPC Package Dispenser Machine Automatic Silicone Wafer Equipment Factory MOQ:1 Piece
High Precision Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, Glass, Sic, PCB Board $500000.00MOQ:1 Set
Higher Accuracy Wire Bonding/Welding Machine for to, Sot, Sop, Ssop, Tssop, Solc, Qfp, DIP, BGA, COB $170000.00MOQ:1 Box
High Precision Vacuum Plasma Cleaning Machine Omnidirectional Surface Cleaning for Semiconductor $1000000.00MOQ:1 Piece
Xy Axis Carbon Dioxide Marking Machine $100000.00MOQ:1 Piece
High Precision Wafer Thinning Machine Grinding Equipment Manufacturers Industrial Automation Device MOQ:1 Piece
Automatic CCD Visual Glue Dispenser Machine Semiautomatic Three-Axis Desktop Dispensing Robot Equipment Factory MOQ:1 Piece
High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device $1000000.00MOQ:1 Set
High-Precision 3D Systems Mjp Jewelry Wax Model 3D Printer $100000.00MOQ:1 Piece
Company Profile
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in exporting business and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers! We manufacture equipments for Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting(Glass Ceramics Wafers Packaging, Laser Internal Modification Machine Si /Sic Wafe, Laser Internal Modification Machine Lt/Ln Wafer, Laser Annealing Machine for Si/Sic, Automatic Dicing Saw Machine(Wafer Packaging)), Automatic Silicone Dispensing Equipment. As well as we provide some solutions for handling exhausted metal sorter equipments, customized coating and plating machine, TGV & manual/semiautomatic/automatic equipments... [View More..]
Contact Us
Company Name Jiangsu Himalaya Semiconductor Co., Ltd.
Company Address Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China  
Location Jiangsu, China
Contact Person Mr. Jack
Department (Position) General Manager Office Departm (Deputy General Manager)