1.15mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging Video - MadeInChina.com

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1.15mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging 2025-04-09 2110IP Unknown
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Product Specifications

Model NO.:

1.15mil

Type:

Bare

Conductor Type:

Alloy

Application:

Microelectronics, LED Packaging, IC Packaging

Conductor Material:

Alloy

Material Shape:

Round Wire

Range of Application:

Microelectronics, LED Packaging, IC Packaging

Certification:

ISO9001, CE, CCC, RoHS

Length:

500m or 1000m

Wire Diameter:

0.7-3.0mil

Material:

Au, AG, Pd, Cu

Transport Package:

Bubble Chamber, Paper Box

Origin:

China

You May Like: Alloy, Copper Wire, Silver Wire, Gold Wire, Bongding Wire

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