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Direct Bond Copper Dbc Metallization High Performance Aln Aluminium Nitride Substrate

2025-04-09 2790

  • Direct Bond Copper Dbc Metallization High Performance Aln Aluminium Nitride Substrate

  • 279 views

Product Specifications

Customized
Laser Diode (Ld)
Ceramic Circuit Board
Aluminium Nitride (Aln) Ceramic
Direct Bond Copper (Dbc / Dcb)
Strong Bonding Strength Between Ceramic and Metal
JingHui
Vacuum Packaging
According to the Drawing
China
8547100000
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