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Semiconductor Device Fabrication Fab Wafer Fabrication Etching Inductively Coupled Plasma Etching Machine Icp for Si/Sio2/Sinx/ Sic Beol Feol

Name: Semiconductor Device Fabrication Fab Wafer Fabrication Etching Inductively Coupled Plasma Etching Machine Icp for Si/Sio2/Sinx/ Sic Beol Feol
Uploaded: 2025-03-24T05:14:07+08:00

2025-04-09 4700

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Product Specifications

Model NO.:

MD150-SICP

After-sales Service:

Installation, Training

Warranty:

One Year Warranty

Type:

Electrical Etching Machine

Object:

Silicon-Based:Si/Sio2/Sinxsic

Usage:

Corrosion & Hollowed-out

Certification:

ISO9001: 2000, CE

Etching Type:

Reactive Ion Etching

Precision:

High Precision

Condition:

New

Trademark:

Minder-Hightech

Transport Package:

Wooden Case

Specification:

1170*750*1080mm

Origin:

China

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