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1.15mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging Video, Demo, How It Works & Features

Published: 2025-04-09 Published by: Shenzhen Silver Technologies Ltd 221 views 0 comments

Product Specifications

Model NO.:
1.15mil
Type:
Bare
Conductor Type:
Alloy
Application:
Microelectronics, LED Packaging, IC Packaging
Conductor Material:
Alloy
Material Shape:
Round Wire
Range of Application:
Microelectronics, LED Packaging, IC Packaging
Certification:
ISO9001, CE, CCC, RoHS
Length:
500m or 1000m
Wire Diameter:
0.7-3.0mil
Material:
Au, AG, Pd, Cu
Transport Package:
Bubble Chamber, Paper Box
Origin:
China
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