Excellent Thermal Conductivity Aluminium Nitride Aln Ceramic Substrate Video, Demo, How It Works & Features
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Product Specifications
Model NO.:
WTK-Substrate
Application:
Electronic Devices, Lighting, Power Supply, Semiconductors
Conductive Layer:
Thick Copper Layer
Material:
AlN
Process:
Direct Bonded Copper
Thickness:
0.25, 0.32, 0.38, 0.5, 0.635, 0.76, 1, 2mm
Density:
3.33G/Cm3
Color:
Grey
Flexural Strength:
450 MPa
Thermal Conductivity:
>180 W/M.K
Dielectric Strength:
>20 Kv/mm
Type:
Ceramic Plate
Trademark:
WINTRUSTEK
Transport Package:
Carton, Wooden Box, Pallet
Specification:
Customized
Origin:
Fujian, China
HS Code:
8547100000