Direct Bond Copper Dbc Metallization High Performance Aln Aluminium Nitride Substrate Video, Demo, How It Works & Features
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Product Specifications
Model NO.:
Customized
Application:
Laser Diode (Ld)
Finished Product:
Ceramic Circuit Board
Substrate Material:
Aluminium Nitride (Aln) Ceramic
Surface Metallization Process:
Direct Bond Copper (Dbc / Dcb)
Feature:
Strong Bonding Strength Between Ceramic and Metal
Trademark:
JingHui
Transport Package:
Vacuum Packaging
Specification:
According to the Drawing
Origin:
China
HS Code:
8547100000