Repair BGA Planting Lead-Free Solder Ball Sn96.5AG3cu0.5 Diameter 0.5mm Tin Particles Video, Demo, How It Works & Features
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Product Specifications
Model NO.:
305
Composition:
Sn96.5AG3cu0.5
Quantity:
250K
Application:
Melting Point
Melting Point:
217°c
Trademark:
PROFOUND
Transport Package:
Carton+Foam Box
Specification:
1pc
Origin:
Taiwan