Sn62pb36AG2 MID Temperature Leaded Soldering Tin Lead Silver Solder Paste for PCB SMT SMD BGA Reballing Video, Demo, How It Works & Features
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Product Specifications
Model NO.:
Sn62pb36AG2 Solder Paste
state:
Liquid
pH:
Neutral
Type:
Organic
Melting Point:
<200℃
Chemical Composition:
Tin
Function:
Remove Oxides
Application:
SMT
Manufacturing Method:
Smelting
Alloy:
Lead Free
Powder Size:
Type 3: 25 to 45 Microns
Powder Size 2:
Type 4: 20 to 38 Microns
Flux:
No Clean Flux
Alloy 2:
Sac305 Sn96.5AG3.0cu0.5
Alloy 3:
Sac0307 Sn99AG0.3cu0.7
Alloy 4:
Sn42bi58 Low Temperature
Certificate:
RoHS
Packing:
Jar
Packing 2:
Syringe
Shipping:
Courier / Air Freight
Shelf Life:
6months
Storage:
0 to 10 Degree Celsius
Application 2:
for SMT SMD PCB Soldering
Application 3:
for Welding
Trademark:
XF Solder
Transport Package:
Foam Box
Specification:
100g to 1000g
Origin:
China
HS Code:
3810100000