China Quality Research Grade 6-Inch Silicon Carbide Wafer

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Hangzhou HCJingRui Technology Co., Ltd.

VIP   Audited Supplier 2 years
Profile Certified by SGS/BV
6 inch Research Grade
HC
Purity>99.9999%
China
2849200000
Product Description
       SIC Silicon Carbide Conductive, Semi-Insulating Substrate Wafers (Customizable) ★2" 4"6" 8" Conductive Silicon Carbide Substrate Wafers Silicon Carbide (SiC) is a new type of compound semiconductor material with superior performance. Silicon carbide semiconductors have excellent properties such as large bandgap width (about 3 times that of silicon), high critical field strength (about 10 times that of silicon), and high thermal conductivity (about 3 times that of silicon). They are ideal semiconductor materials for making high-temperature, high-frequency and high-power power electronic devices (power chips). At the same time, it is also an excellent semiconductor material second only to diamond. At present, we provide standard 2, 4, 6, and 8-inch silicon carbide substrate wafers. Used for the production of Schottky diodes (SBD), metal oxide semiconductor field effect transistors (MOSFET), junction field effect transistors (JFET) and bipolar junction transistors (BJT). These power electronic devices can be widely used in green energy and energy-saving systems including solar inverters, wind power generation and energy storage, hybrid power, electric vehicles, charging piles, smart grids, and household appliances.

   
                                                                                                6 Inch N-type SiC substrate wafer
 
No.ItemsUnitUltra-P GradeProduction GradeResearch GradeDummy Grade
1.Boule Parameters
1.1Poly type--4H
1.2Surface orientation error°4° toward  <11-20>±0.15°4°  toward  <11-20>±0.5°4° toward  <11-20>±0.5°4°  toward  <11-20>±0.5°
2.Electrical Parameters
2.1dopantcm-³n-type Nitrogen
2.2resistivityohm ·cm0.016~0.024ohm ·cm0.015~0.025ohm ·cm0.015~0.025ohm ·cmNA
3.Mechanical Parameters
3.1diametermm150 ±0.25 mm
3.2hicknessμm350±25μm
3.3Primary flat orientation°[1-100]±5°
3.4Primary flat lengthmm47.5±1.5mm47.5±2.5mm47.5±2.5mm47.5±2.5mm
3.5LTVμm≤2μm(10mm*10mm)≤5μm(10mm*10mm)≤10μm(10mm*10mm)≤15μm(10mm*10mm)
3.6TTVμm≤5μm≤10 μm≤15 μm≤20 μm
3.7Bowμm-15 μm~15  μm-25 μm~25  μm-45 μm~45   μm-65  μm~65  μm
3.8Warpμm≤20μm≤35μm≤50μm≤70μm
3.9(AFM)Front(Si-face)RoughnessnmRa≤0.2nmRa≤0.2nmRa≤0.2nmRa≤0.2nm
4.Structure
4.1micropipe densityea/cm²≤0.15 ea/cm²≤0.5 ea/cm²≤1 ea/cm²≤2 ea/cm²
4.2metal contentatoms/cm²≤5E10 atoms/cm²≤1E11 atoms/cm²≤1E11 atoms/cm²NA
4.3TSDea/cm²≤100ea/cm²≤300ea/cm²≤500ea/cm²NA
4.4BPDea/cm²≤600ea/cm²≤1000ea/cm²≤1500ea/cm²NA
5.Front Quality
5.1front--SiSiSiSi
5.2surface finish--Si-face CMPSi-face CMPSi-face CMPSi-face CMP
5.3particleea/wafer≤60(size≥0.3 μm)≤100(size≥0.3 μm)NANA
5.4scratchesea/mm≤2,Total Length≤1/2*Diameter≤5,Total Length≤DiameterNANA
5.5chips/indents/cracks/stai--NoneNoneNoneNA
5.6Polytype areas--None≤0.5%Cumulative area)≤2%Cumulative area)≤5%Cumulative area)
5.7front marking--NoneNoneNoneNone
6.Back Quality
6.1back finish--C-face polished
6.2scratchesea/mm≤5,Total Length≤DiameterNANANA
6.3Back defects edge--NoneNoneNoneNA
6.4Back roughnessnmRa≤0.2nm(5μm*5μm)Ra ≤5nmRa ≤5nmRa ≤5nm
7.Edge
7.1Wafer Edge--ChamferChamferChamferChamfer
8.Packaging
8.1Packaging--Epi-ready with vacuum packaging
8.2Packaging--Multi-waferorSingle wafer cassette packaging
SEMI-STDNotes:"NA"means no request.Items not metioned may refer to SEMI-STD.

FAQ

 

Q1: What's the way of shipping ?
A:  We accept DHL, Fedex, TNT, UPS, EMS, SF and etc.
Q2: How to pay?
A:  T/T, PayPal and etc..
Q3: What's the deliver time?
A:  For inventory: the delivery time is 10 workdays.   For customized products: the delivery time is 10to 25 workdays. According to the quantity.
Q4: Can I customize the products based on my need?
 A: Yes, we can customize the specifications according to your needs.
Q5: How to guarantee the quality of your products?
 A: Strict detection during production.Strict sampling inspection on products before shipment and intact product packaging ensured.

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