Audited Supplier
Gold-Tin Thin-Film Submount
Aln, Al2O3, Wcu, Mocu, Quartz, Si, etc
Ti/PT/Au, Ti/Ni/Au, Ausn etc
OEM, ODM
2-3 Weeks
RoHS, ISO 9001, ISO 14001, GB/T 29490
Air Freight
XianYi
Bulk, Blue Film Packaging
Gold-Tin Thin-Film Heatsink Submount
Guangzhou
8541900000
Product Description
Gold-Tin Thin-Film Heatsink Submount
Features:
- Alloy film with good solderability
- Flexible process suitable for different batches
- Eco-friendly
Description:
The AuSn thin film heat sink is a kind of AuSn solder coated submounts used as IC substrates or hermetic package lids in the packaging of devices such as laser diodes, power semiconductor devices and UVC LED. The thickness of AuSn solder on bonding
area can be precisely controlled within several micrometre. In the light that AuSn solder has been deposited on the surface of the substrate, no additional solder preforms or solder paste are necessary when soldering, resulting in high packaging efficiency.
Technical Specification:
Applications:
Storage and Product Management
- Storage
The best storage temperature of this product is 25±5 ºC, and the relative humidity is no higher than 55%RH.
- Product management
Keep container tightly closed when product is not in use.
Safety:
- Please use this product with adequate ventilation and certain personal protection conditions.
- Please do not mix with other toxic chemicals.
Features:
- Alloy film with good solderability
- Flexible process suitable for different batches
- Eco-friendly
Description:
The AuSn thin film heat sink is a kind of AuSn solder coated submounts used as IC substrates or hermetic package lids in the packaging of devices such as laser diodes, power semiconductor devices and UVC LED. The thickness of AuSn solder on bonding
area can be precisely controlled within several micrometre. In the light that AuSn solder has been deposited on the surface of the substrate, no additional solder preforms or solder paste are necessary when soldering, resulting in high packaging efficiency.
Technical Specification:
| AuSn solder layer | Composition | AuSn, Au 70~80 ±5 wt.% |
| Thickness & Tolerance | 2~ 10 μm ± 20% | |
| Substrate material | AlN , Al2O3, WCu, MoCu, quartz , Si , etc. | |
| Metallization layer | Ti/Pt/Au, Ti/Ni/Au, etc. | |
Gold-Tin Thin-Film Submount used in Laser Diode Pump Source Application
Storage and Product Management
- Storage
The best storage temperature of this product is 25±5 ºC, and the relative humidity is no higher than 55%RH.
- Product management
Keep container tightly closed when product is not in use.
Safety:
- Please use this product with adequate ventilation and certain personal protection conditions.
- Please do not mix with other toxic chemicals.
