

U.PCM250 phase change interfacial thermal conductivity materials are engineered to improve heat sink performance and enhance component reliability. Our U.PCM250 series minimizes interfacial thermal resistance and ensures unparalleled efficiency. It excels in filling interfacial gaps and voids, consistently delivering exceptional performance. Experience the pinnacle of innovation with our self-developed U.PCM250 series, combining superior thermal management with rugged reliability.
Benefits
Phase change ~50ºC;
Excellent interface wetability ;
High reliability: high polymer;
RoHS compliant;
Form:pad;
