Audited Supplier
Focusing on the chip unsealing industry, with mature capabilities
Industry solutions that provide stability
Efficient laser sealing equipment
Laser
• Galvohead
• Kameras
• Special unfolding software
laser Wavelength 1064nm
Power 20W
F θ Lens Box: 100 * 100mm
Cooling method: air cooling
Electric platform XYZ stroke 300 * 300 * 300mm
Platform repeatability accuracy ± 0.02mm
Camera positioning system: Two 5 million color positioning cameras (with a field of view of 40 * 30mm,
12 * 10mm), one real-time observation camera (150 * 80mm)
Stage XY θ Adjustable
Double layer filter element for dust removal system, filtering, etc. 0.3um
Equipment overall size 1500 * 860 * 1800mm
Power supply three-phase AC 400V, 50Hz/60Hz, 16A
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
