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EV Extral Fast Charging Piles DC-DC High Power Interleaved LLC Topologies Fast Recovery Diode Frd Osg60r030hzf To247 Power Mosfet
| Price | $0.20 |
|---|---|
| Min Order | 660 Pieces |
| Availability | In Stock |
| Shipping From | Shanghai, China |
| Popularity | 312 people viewed |
Model NO.:
OSG60R030HZF TO247
Certification:
RoHS, ISO
Shape:
Metal Porcelain Tube
Shielding Type:
Sharp Cutoff Shielding Tube
Cooling Method:
Air Cooled Tube
Function:
Microwave Transistor, Switch Transistor
Working Frequency:
High Frequency
Structure:
Planar
Encapsulation Structure:
Plastic Sealed Transistor
Power Level:
Medium Power
Material:
Silicon
Description:
Extremely Low Switching Loss
Characteristics:
Excellent Stability and Uniformity
Applications:
PC Power
Industries:
LED Lighting
Type:
Fast EV Charging Station
Warranty:
24 Months
Trademark:
Orientalsemiconductor
Transport Package:
Carton
Specification:
TO247
Origin:
China
HS Code:
854129000
Product Description
General Description
The GreenMOS® high voltage MOSFET utilizes charge balance technology to achieve outstanding low on-resistance and lower gate charge. It is engineered to minimize conduction loss, provide superior switching performance and robust avalanche capability.The GreenMOS® Z series is integrated with fast recovery diode (FRD) to minimize reverse recovery time. It is suitable for resonant switching topologies to reach higher efficiency, higher reliability and smaller form factor.
Features
- Low RDS(ON) & FOM
- Extremely low switching loss
- Excellent stability and uniformity
- Ultra-fast and robust body diode
Applications
- PC power
- Telecom power
- Server power
- EV Charger
- Motor driver
Key Performance Parameters
| Parameter | Value | Unit |
| VDS, min @ Tj(max) | 650 | V |
| ID, pulse | 240 | A |
| RDS(ON), max @ VGS=10V | 30 | mΩ |
| Qg | 178 | nC |
Marking Information
| Product Name | Package | Marking |
| OSG60R030HZF | TO247 | OSG60R030HZ |
Absolute Maximum Ratings at Tj=25°C unless otherwise noted
Thermal Characteristics
Electrical Characteristics at Tj=25°C unless otherwise specified
| Parameter | Symbol | Value | Unit |
| Drain-source voltage | VDS | 600 | V |
| Gate-source voltage | VGS | ±30 | V |
| Continuous drain current1), TC=25 °C | ID | 80 | A |
| Continuous drain current1), TC=100 °C | 50 | ||
| Pulsed drain current2), TC=25 °C | ID, pulse | 240 | A |
| Continuous diode forward current1), TC=25 °C | IS | 80 | A |
| Diode pulsed current2), TC=25 °C | IS, pulse | 240 | A |
| Power dissipation3), TC=25 °C | PD | 480 | W |
| Single pulsed avalanche energy5) | EAS | 2500 | mJ |
| MOSFET dv/dt ruggedness, VDS=0…480 V | dv/dt | 50 | V/ns |
| Reverse diode dv/dt, VDS=0…480 V, ISD≤ID | dv/dt | 50 | V/ns |
| Operation and storage temperature | Tstg, Tj | -55 to 150 | °C |
Thermal Characteristics
| Parameter | Symbol | Value | Unit |
| Thermal resistance, junction-case | RθJC | 0.26 | °C/W |
| Thermal resistance, junction-ambient4) | RθJA | 62 | °C/W |
Electrical Characteristics at Tj=25°C unless otherwise specified
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
| Drain-source breakdown voltage | BVDSS | 600 | V | VGS=0 V, ID=1 mA | ||
| Gate threshold voltage | VGS(th) | 3.0 | 4.5 | V | VDS=VGS, ID=2 mA, | |
Drain-source on-state resistance | RDS(ON) | 0.028 | 0.030 | Ω | VGS=10 V, ID=40 A | |
| 0.058 | VGS=10 V, ID=40 A, Tj=150 °C | |||||
| Gate-source leakage current | IGSS | 100 | nA | VGS=30 V | ||
| -100 | VGS=-30 V | |||||
| Drain-source leakage current | IDSS | 10 | μA | VDS=600 V, VGS=0 V | ||
| Gate resistance | RG | 2.1 | Ω | ƒ=1 MHz, Open drain |
Dynamic Characteristics
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
| Input capacitance | Ciss | 9343 | pF | VGS=0 V, VDS=50 V, ƒ=100 KHz | ||
| Output capacitance | Coss | 708 | pF | |||
| Reverse transfer capacitance | Crss | 15 | pF | |||
| Effective output capacitance, energy related | Co(er) | 345 | pF | VGS=0 V, VDS=0 V-400 V | ||
| Effective output capacitance, time related | Co(tr) | 1913 | pF | |||
| Turn-on delay time | td(on) | 52.1 | ns | VGS=10 V, VDS=400 V, RG=2 Ω, ID=40 A | ||
| Rise time | tr | 105.2 | ns | |||
| Turn-off delay time | td(off) | 125.7 | ns | |||
| Fall time | tf | 4.1 | ns |
Gate Charge Characteristics
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
| Total gate charge | Qg | 177.9 | nC | VGS=10 V, VDS=400 V, ID=40 A | ||
| Gate-source charge | Qgs | 37.4 | nC | |||
| Gate-drain charge | Qgd | 78.4 | nC | |||
| Gate plateau voltage | Vplateau | 6.2 | V |
Body Diode Characteristics
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
| Diode forward voltage | VSD | 1.4 | V | IS=80 A, VGS=0 V | ||
| Reverse recovery time | trr | 186.6 | ns | IS=40 A, di/dt=100 A/μs | ||
| Reverse recovery charge | Qrr | 1.6 | μC | |||
| Peak reverse recovery current | Irrm | 15.4 | A |
Note
- Calculated continuous current based on maximum allowable junction temperature.
- Repetitive rating; pulse width limited by max. junction temperature.
- Pd is based on max. junction temperature, using junction-case thermal resistance.
- VDD=100 V, VGS=10 V, L=80 mH, starting Tj=25 °C.
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